The T.I.C. 67th General Assembly and Conference brought together the international tantalum and niobium community in Yinchuan, China, from 13–16 September 2026 for technical exchange, market perspectives and professional networking.
The published technical programme covered a wide range of topics, from the growing role of tantalum in AI infrastructure and advanced semiconductors to critical raw materials, responsible sourcing, recycling and emerging manufacturing technologies.
Among the materials being made available is a presentation by Dr Melanie Stenzel of TANIOBIS, exploring tantalum in next-generation AI power delivery, including energy efficiency, evolving power architectures and advances in high-voltage tantalum powders.
Explore the resources below to revisit GA67. Conference photographs are publicly accessible, while presentation documents are available to T.I.C. members. Further conference highlights and insights will be added when available.
Presentation materials are initially reserved for T.I.C. members. Under the existing archive arrangements, documents become publicly accessible after 12 months.
