Looking Back at GA67
The T.I.C. 67th General Assembly and Conference brought together the international tantalum and niobium community in Yinchuan, China, from 13-16 September 2026 for technical exchange, market perspectives and professional networking.
The technical programme explored developments across tantalum and niobium, from AI infrastructure, advanced semiconductors and power delivery to refractory alloys, critical raw materials, responsible sourcing, recycling and emerging manufacturing technologies.
Available Presentations
Presentation materials now available include Dr Melanie Stenzel of TANIOBIS exploring tantalum in next-generation AI power delivery, including rising energy demand, the move towards higher-voltage DC power architectures and the advantages of Mg-reduced high-voltage tantalum powders. Also available is Josh Pierce of ATI Specialty Alloys & Components examining the modernisation of niobium alloy development, drawing on the history of refractory alloys while looking at additive manufacturing, hafnium supply pressures and the development of alternative Hf-free niobium alloys.
Explore the resources below to revisit GA67. Conference photographs are publicly accessible, while the available presentation documents provide a closer look at some of the technical subjects discussed during the conference. Further conference content will be added when available.
Presentations
Members-only documentsPhotographs
Public event galleryHighlights & Insights
Coming soonPresentation materials are initially reserved for T.I.C. members. Under the existing archive arrangements, documents become publicly accessible after 12 months.
